This work is devoted to investigate the tensile properties of the newly developed Sn?9Zn?xBi (1, and 4 wt.%) lead free solder alloys at different strain rates and temperatures to compare the results with the eutectic Sn?9Zn. also, the investigation of creep characteristics at different stresses and temperatures for selected lead-free solder alloys are presented. The microstructure and the thermal properties of these alloys were also thoroughly investigated and further, to determine the effect of Bi addition on promoting the properties of Sn?Zn alloys.
|Number of Pages||128|
|Country of Manufacture||India|
|Product Brand||LAP LAMBERT Academic Publishing|
|Product Packaging Info||Box|
|In The Box||1 Piece|
|Product First Available On ClickOnCare.com||2015-08-18 00:00:00|