☰ Category

Etching performance of silicon wafers with redesigned etching drum


Marketed By :  LAP LAMBERT Academic Publishing   Sold By :  Kamal Books International  
Delivery in :  10-12 Business Days


Check Your Delivery Options

Product Out of Stock Subscription

(Notify me when this product is back in stock)

Rs. 4,396

Availability: Out of stock

  • Product Description

Etching process involves various chemical reactions and reflects significantly on silicon wafer quality. Design of Experiments (DOE) with full factorial design is employed for optimization purpose. Etching factors namely the bubbling flow rate, wafer rotation, and etchant temperature had been randomized with additional three center points to observe any curvature. The responses studied are etching removal, total thickness variation (TTV) and wafer brightness. Additionally, the etchant temperature and bubbling flow rate provide interaction effect on both etching removal and wafer brightness. A higher bubbling flow rate is required to ensure etching removal and brightness within specification. Besides studying these three responses, the wafer surface after etching is analyzed using ADE Infotool software which captures the etched surface profile and its thickness. Finally, the removal uniformity throughout the redesigned etching drum is observed. Etching performance is enhanced with the optimized value of bubbling flow rate, etchant temperature and wafer rotation to achieve the optimum etching removal distribution.

Product Specifications
SKU :COC57347
AuthorRozzeta Dolah and Hamidon Musa
Number of Pages132
Publishing Year2012-01-18T00:00:00.000
Edition1 st
Book TypeProduction engineering
Country of ManufactureIndia
Product BrandLAP LAMBERT Academic Publishing
Product Packaging InfoBox
In The Box1 Piece
Product First Available On ClickOnCare.com2015-06-08 00:00:00
0 Review(s)