This book is discussing about the usage of nanofluid as a coolant for electronic devices. Nanofluids are the suspension of solid nanoparticles in a base fluid. Nanofluids are expected to be a promising coolant candidate for thermal management system of next generation high heat dissipation electronic systems. In this research, thermal conductivity, heat transfer and pumping power for a nanofluid turbulent flow in copper minichannel heat sink is analyzed. Nanofluids with a different volume fraction and with 2 m/s and 6m/s inlet velocities are used.A minichannel heat sink with the bottom analyzed for SiC water nanofluid and TiO2 water nanofluid turbulent flow as a coolant through hydraulics diameters and heat flux boundary condition are assumed.