Temperature is a first class design concern in modern integrated circuits. The important increase in power densities associated to recent technology evolutions has lead to the apparition of thermal gradients and hot spots during run time operation. Temperature impacts several circuit parameters such as speed, cooling budgets, reliability, power consumption, etc. In order to fight against these negative effects, dynamic thermal management techniques adapt the behavior of the chip relying on the information of a monitoring system that provides run-time thermal information of the die surface. This book covers the most important topics related to on-chip thermal monitoring, such as the design, placement and interconnection of temperature sensors, from a practical perspective.