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Passive Chemical Project


Marketed By :  LAP LAMBERT Academic Publishing   Sold By :  Kamal Books International  
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  • Product Description

The corrosion current of bare copper metal was determined in ferric ion and in hydrogen peroxide solutions and was found to be close to the CMP rate reported in the literature. This leads to the new conclusion that copper CMP is mainly a corrosive wear process that occurs at the abraded spots on the wafer surface, the high spots. Cu(I)BTA film forms only at the low areas which are not being abraded. This finding calls for the revision of the conventional view that CMP involves a successive sequence of film formation and removal.

Product Specifications
SKU :COC37506
AuthorRajendra Parsad
Number of Pages216
Publishing Year1/14/2010
Edition1 st
Book TypeChemistry
Country of ManufactureIndia
Product BrandLAP LAMBERT Academic Publishing
Product Packaging InfoBox
In The Box1 Piece
Product First Available On ClickOnCare.com2015-07-31 00:00:00